1. 2. 3. material content data sheet sales product name ipp093n06n3 g issued 29. august 2013 ma# MA000957262 package pg-to220-3-1 weight* 2030.28 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.120 0.10 0.10 1044 1044 leadframe non noble metal iron 7439-89-6 1.407 0.07 693 inorganic material phosphorus 7723-14-0 0.422 0.02 208 non noble metal copper 7440-50-8 1404.801 69.20 69.29 691925 692826 wire non noble metal aluminium 7429-90-5 2.813 0.14 0.14 1385 1385 encapsulation organic material carbon black 1333-86-4 5.955 0.29 2933 plastics epoxy resin - 113.141 5.57 55727 inorganic material silicondioxide 60676-86-0 476.385 23.46 29.32 234640 293300 leadfinish non noble metal tin 7440-31-5 21.462 1.06 1.06 10571 10571 plating non noble metal nickel 7440-02-0 0.244 0.01 120 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 0 120 solder non noble metal antimony 7440-36-0 0.153 0.01 75 noble metal silver 7440-22-4 0.383 0.02 189 non noble metal tin 7440-31-5 0.996 0.05 0.08 490 754 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
